| 摘要 |
PROBLEM TO BE SOLVED: To increase the number of substrates mounted to a substrate holder compared with conventional techniques while uniformity of a heat treatment is ensured without the risk of having the treatment object substrates stick to each other. SOLUTION: In the heat treatment method, the plurality of substrates (w) to be treated are mounted to the substrate holder 11 at predetermined vertical intervals; the substrate holder 11 is carried into a heat treating furnace 3; and a predetermined heat treatment is performed on the substrates (w). In the heat treatment method, a double-plate unit 32 is configured by supporting two of the substrates (w) through support rings 31 at edge parts to face the backsides of the respective substrates (w) thereof; the plurality of the double-plate units 32 are held to the substrate holder 11 at a vertical interval Pb larger than the interval Pa of the substrates (w) on the double-plate unit 32; and thus the interval Pa between the backsides of the substrates (w) is set smaller than the interval Pb between the front surfaces thereof. COPYRIGHT: (C)2009,JPO&INPIT
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