发明名称 ELECTROPLATING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an electroplating method where electroplating can be repeated while maintaining an electroplating bath to a satisfactory state over a long period in such a manner that high uniform electrodeposition properties and satisfactory appearance can be imparted to a plating film to be formed, thus a stable plating film can be obtained over a long period even without frequently performing regeneration treatment such as electrolytic treatment for reducing the concentration of metal ions in the plating bath, and which is made extremely economical. SOLUTION: By an electroplating bath comprising the ions of one or more metals selected from cobalt, nickel and iron, a buffer, a conductive agent and halide ions, the concentration of the conductor in the electroplating bath upon initial make-up is controlled to 70 to 95% of the saturated concentration, the reduced plating bath components in the electroplating bath are replenished by adding a powdery metal salt, a powdery buffer, a powdery conductive agent or a powdery halide or a saturated liquid or a suspension comprising one or more kinds thereamong to the electroplating bath, thus the concentration of the conductive agent in the electroplating bath after the replenishment is controlled to 70 to 95% of the saturated concentration, and the electroplating is repeated. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009079247(A) 申请公布日期 2009.04.16
申请号 JP20070248643 申请日期 2007.09.26
申请人 C UYEMURA & CO LTD 发明人 MURAKAMI TORU;IEJI TOMOMI
分类号 C25D21/14;C25D3/56 主分类号 C25D21/14
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