| 摘要 |
PROBLEM TO BE SOLVED: To solve the following problem: as to an inspection device to inspect a conductive pattern by a non-contact sensor, the movement accuracy and the technical difficulty level of the moving mechanism of a sensor part becomes high during inspection by the height differences on the surface of an inspection stage and the warp of the substrate which are caused by a larger-sized substrate, and even its manufacturing cost is affected thereby. SOLUTION: In this circuit pattern inspection device formed by using a simple conveyance mechanism, the non-contact sensor part and the inspection stage are fixed during inspection, the substrate to be conveyed passes between them with the substrate floated from the inspection stage by a fixed distance, a distance between the conductive pattern on the substrate to be inspected and the sensor part becomes fixed, and vertical fluctuation such as waviness or the like on the potential level of a detected detection signal is suppressed. COPYRIGHT: (C)2009,JPO&INPIT
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