| 摘要 |
A semiconductor package is provided to partially limit a useless dummy region by forming a dummy lead on a position of a substrate corresponding to an align key formed on a semiconductor chip. A semiconductor package includes a semiconductor chip(110), a substrate(120), an align key(113), and a dummy lead(123). The semiconductor chip is extracted from a disk type wafer. Terminals(111) connected to an electronic circuit device are protruded from one surface of the semiconductor chip. A lead(121) and a pattern corresponding to the terminals are formed on a top of the semiconductor chip. The substrate is adhered to the semiconductor chip by a lead on chip method or a flip chip method. The align key is formed on a top of the semiconductor chip. The dummy lead is formed on an edge position corresponding to the align key. |
