| 摘要 |
A spin coating device and a method for forming an insulation film of a semiconductor device are provided to uniformly coat a coating material on a top of a wafer by depositing the coating material with a planarization member pressurizing an insulation film. A dispersion prevention cover(1) prevents a dispersion of a coating material provided from a coating material providing unit, and includes a drain valve(7). A rotation unit(6) includes a motor(3), a rotation shaft(5), and a support member(8). The motor is arranged on an outer part of the dispersion prevention cover. The other side of the rotation shaft is connected to the support member. A semiconductor substrate(9) is arranged on the support member. A second vibration unit(4) is arranged on the motor. A coating layer(10) is formed on a top of the semiconductor substrate by using the coating material provided from the coating material providing unit(16). A planarization member(11) faced with the support member is arranged on the top of the semiconductor substrate. A first height control unit(12) controls a gap between the support member and the planarization member. The planarization member is connected to the coating material providing unit. The coating material providing unit includes a nozzle part(13), a pipe(14), and a coating material supply source(15).
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