发明名称 LAMINATED CHIP ELEMENT
摘要 A laminate chip device is provided to protect an inner circuit from an over voltage and a static electricity by coupling a varistor device and various devices. A laminate chip device includes a plurality of laminate sheets(10,20,30,40,50) and a resistance pattern(70). The laminate sheets include conductive patterns(11,21,31,41,51). A first ground pattern is formed on a first laminate sheet. A plurality of first internal electrodes is formed on a second laminate sheet. A second ground pattern is formed on a third laminate sheet. A plurality of second internal electrodes is formed on a fourth laminate sheet. A third ground pattern is formed on a fifth laminate sheet. The first internal electrode is connected to a first external terminal electrode(81). The first ground pattern, the second ground pattern, and the third ground pattern are connected to a second external terminal electrode(82). The second internal electrode is connected to a third external terminal electrode(83). The ground pattern is extended to one surface of the laminate sheet, and includes at least one protrusion pattern.
申请公布号 KR20090037099(A) 申请公布日期 2009.04.15
申请号 KR20070102534 申请日期 2007.10.11
申请人 INNOCHIPS TECHNOLOGY 发明人 PARK, IN KIL;NOH, TAE HYUNG;JANG, KYU CHEOL;LEE, MYUNG HO;LEE, JUNG HUN;HYUN, JIN KUG
分类号 H01L23/12 主分类号 H01L23/12
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