| 摘要 |
A lead frame for the semiconductor package is provided to change the structure of the inner lead and to recognize the sort of the semiconductor package and to improve the yield of the semiconductor package. The forming process of the lead frame comprises as follows. Firstly, the recognition part recognizing the type of the semiconductor package is formed on the part adjacent to the inner lead of the lead frame. The next, and the process of a wire bonding of the semiconductor chip are performed and the semiconductor package is formed. The lead frame(100) for the semiconductor package is comprised of the semiconductor chip plate(102) and plurality of tie bars(104). The semiconductor chip is arranged in the center area of the mounting board. The lead(112) consisting of a plurality of inner leads(108) and outer lead(110) is formed in the outer side of board. The recognition part(106) recognizes clearly the kind of chip to bond the wire accurately. |
