| 摘要 |
<p>A light emitting diode package and a manufacturing method thereof are provided to improve quality of a package light source by uniformly forming a reaction distance between a light emitting diode chip and a phosphor. A package body(110) is made of a silicone based wafer level package. A firs cavity(115) is formed on a top part of the package body. A second cavity(117) is formed on a bottom part inside the first cavity. The first cavity and the second cavity are formed by using a dry etching or a wet etching mode. A first side(112) of the first cavity and a second side(114) of the second cavity are formed into an outer direction based on a vertical axis about a cavity floor surface. Electrode layers(141,142) are formed on a surface of the package body. At least one light emitting diode chip(120) is mounted on the electrode layer. A second light-transmitting member(130) is formed on the second cavity. A first light-transmitting member(132) is formed on the first cavity. A light emitted from the light emitting diode chip transmits the second light-transmitting member, and is emitted through the first light-transmitting member.</p> |
