发明名称 Light emitting diode package employing lead terminal with reflecting surface
摘要 Disclosed is a light emitting diode (LED) package having an LED chip (77) mounted within a cavity so as to radiate light emitted from the LED chip in a viewing angle, the LED package comprising: a first lead terminal (71) having a lower portion with an LED chip mounting area, and at least one reflecting surface formed by being bent from the lower portion; a second lead terminal (73) spaced apart from the first lead terminal; and a package body (75) for supporting the first and second lead terminals and defining the cavity through which the LED chip mounting area of the first lead terminal and a part of the second lead terminal are exposed, wherein the first and second lead terminals extend outside of the package body, wherein the first lead terminal has wing portions (71w) forming inclined surfaces by being bent upwardly from the lower portion to face each other, and the reflecting surface includes the inclined surfaces formed by the wing portions, wherein at least a part of the outer surfaces of the wing portions are exposed to the outside.
申请公布号 EP2048719(A1) 申请公布日期 2009.04.15
申请号 EP20090000316 申请日期 2007.06.15
申请人 SEOUL SEMICONDUCTOR CO., LTD. 发明人 KIM, HWA JA;KIM, NAM YOUNG;LEE, MYUNG HEE;HAN, KYOUNG BO;KIM, TAE KWANG;SO, JI SEOP
分类号 H01L33/50;H01L33/56;H01L33/60;H01L33/62;H01L33/64 主分类号 H01L33/50
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