| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device with high reliability that can be mounted on a mount board with high density and causes no resin burr onto the surface of lead electrodes. <P>SOLUTION: The semiconductor device includes a semiconductor element placed on one of a pair of positive negative lead electrodes, a conductor for connecting the semiconductor element to the lead electrodes, and a support for fixing and supporting the lead electrodes. At least part of the lead electrodes and the support and the semiconductor element are covered by a transparent member whose size is greater than an outer circumference of the support when the semiconductor device is viewed from its top side. Further, the semiconductor device has a recessed part at the side face of the support to which part of the transparent member is extended. <P>COPYRIGHT: (C)2004,JPO |
