| 摘要 |
PURPOSE: A semiconductor device package and a fabricating method thereof are provided to prevent the damage and the malfunction of a semiconductor device by discharging effectively the heat of the semiconductor device to the outside. CONSTITUTION: A concavo-convex package(15) having a ground terminal(17) is provided. A semiconductor chip is loaded within the concavo-convex package(15) by using a flip chip method. A thermal conductive layer(18) having high thermal conductivity is formed on a surface of the semiconductor chip loaded within the concavo-convex package(15). A radiative cap(20) is adhered on the thermal conductive layer(18) in order to seal up the concavo-convex package(15). The thermal conductive layer(18) is formed with a metallic material such as Al, Au, Ag, and Cu. |
