| 摘要 |
A printed circuit board for the semiconductor package in which the buffer layer is formed is presented. Therefore, the stress applied in the solder joint part of substrate is relieved. The crack of the solder joint part can be prevented and the reliability can be improved. The printed circuit board is comprised of the insulating layer(250), a plurality of wirings(252), the insulating layer(260), the buffer layer(270), the metal layer(280) for rigidity. The insulating layer has the cavity(212). The wiring has with a plurality of volands and connection pad and is positioned under the insulating layer. The insulating layer is made of the solder resist so that the voland and connection pad part of the wiring be exposed. The buffer layer is formed in the upside of the insulating layer. The metal layer is adhered on the buffer layer.
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