发明名称 LEAD-FREE COPPER ALLOY SLIDING MATERIAL
摘要 When a Cu-Sn-Bi had-particle based sliding material is used for sliding, Cu of Cu matrix flows and covers up Bi phase. Seizure resistance lowers as time passes. A Pb-free sliding material preventing the reduction of seizure resistance is provided. (1) Composition: from 1 to 15% of Sn, from 1 to 15% of Bi, from 0.02 to 0.2% of P, and from 1 to 10% of hard particles having an average diameter of from 50 to 70 µm, with the balance being Cu and unavoidable impurities. (2) Structure: Bi phase and the hard particles are dispersed in the copper matrix, and all of said hard particles are bonded to the copper matrix.
申请公布号 EP2048253(A1) 申请公布日期 2009.04.15
申请号 EP20070791805 申请日期 2007.08.02
申请人 TAIHO KOGYO CO. LTD. 发明人 YOKOTA, HIROMI;YOSHITOME, DAISUKE
分类号 C22C32/00;B22F5/00;C22C1/05;C22C9/00;C22C9/02;F16C33/12 主分类号 C22C32/00
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