发明名称 SEMICONDUCTOR DEVICE HAVING RECESSED FIELD REGION AND FABRICATION METHOD THEREOF
摘要 <p>A semiconductor device having a field recess part and a manufacturing method thereof are provided to increase a channel width of an active region by forming a field recess part on a surface of one side of a field region adjacent to the active region. A field region(102) and an active region(104) are formed on a semiconductor substrate(100). The active region is restricted by the field region. The field region is composed of an STI(Shallow Trench Isolation) region including an oxide film in a trench. A field recess part(116) is formed on a surface of one side of the field region adjacent to the active region, and is a part recessed as a fixed depth(d1) from a surface of the active region. A channel width is increased by securing the active region adjacent to the field region.</p>
申请公布号 KR20090036865(A) 申请公布日期 2009.04.15
申请号 KR20070102151 申请日期 2007.10.10
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 YI, JI HYE;RHEE, HWA SUNG;LEE, HO;KIM, MYUNG SUN
分类号 H01L21/336;H01L29/78 主分类号 H01L21/336
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