METHOD OF INHIBITING CORROSION OF COPPER PLATED OR METALLIZED SURFACES AND CIRCUITRY DURING SEMICONDUCTOR MANUFACTURING PROCESSES,申请号EP20040754548-传众专利搜索

发明名称	METHOD OF INHIBITING CORROSION OF COPPER PLATED OR METALLIZED SURFACES AND CIRCUITRY DURING SEMICONDUCTOR MANUFACTURING PROCESSES
摘要
申请公布号	EP1660954(A4)	申请公布日期	2009.04.15
申请号	EP20040754548	申请日期	2004.06.07
申请人	NALCO COMPANY	发明人	JENKINS, BRIAN, V.;HOOTS, JOHN, E.
分类号	H01L21/02;C23F11/14;H01L21/00;H01L21/288;H01L21/66	主分类号	H01L21/02
代理机构		代理人
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