| 摘要 |
A die attach apparatus for effectively preventing the crack generation of the semiconductor chip is provided to decrease the adhesive force of the tape by irradiating ultraviolet ray and fixing the wafer by using vacuum. The die attach apparatus(100) is to connect the semiconductor chips to the electrical contact means. The die attach apparatus is comprised of the vacuum zig(110), the vacuum kit(114), and the pick-up rubber(102). The wafer(103) which is sawn to each semiconductor chip(104) is placed in the vacuum zig. The vacuum hole corresponding to each semiconductor chip is equipped in the vacuum zig. The pick-up rubber is arranged in the upper of the vacuum zig. The pick-up rubber picks up the semiconductor chip by vacuum. |
