METHOD FOR GRINDING WAFER

摘要

A method for grinding a wafer is provided to generate a gettering effect by using a grinding stone which fixes a diamond abrasive-grain by a vitrified bond. A grinding device includes a chuck table(2) and a grinding unit. The chuck table maintains a wafer. The grinding unit has a grinding wheel(34) which grinds the wafer maintained in the chuck table. A gettering effect is generated by grinding a rear surface of the wafer having a plurality of devices formed on a surface with the grinding device. The grinding wheel includes a base(340) and a grinding stone(341). The grinding stone is fixed in a free end part of the base, and is formed by fixing a diamond abrasive-grain by a vitrified bond. A protective member(6) is adhered on a surface of the wafer, and is faced with the chuck table. A rear surface of the wafer is grinded by the grinding stone by rotating the grinding wheel according to a rotation of the chuck table.