| 摘要 |
<p>A COF(Chip On Film) substrate is provided to obtain a contact reliability and a uniform thickness of a terminal part by making thickness of a first lead and a second lead identical. A COF substrate(1) includes a plurality of wiring parts having a base insulation layer(2) and a conductor pattern(6), and a reinforcing layer(4). A plurality of wiring parts is consecutively installed on a surface of the base insulation layer. A mounting part(5) of a rectangular shape is installed in each wiring part. The conductor pattern is formed in both sides of a long direction of the mounting part, and has a plurality of wirings(7). Each wiring includes an inner lead(8), an outer lead, and a relay lead(10). The inner lead includes a first inner lead(12) and a second inner lead(13). The first inner lead is formed on a plane extended to a long direction with a rectangular shape. The second inner is arranged between the first inner leads. A dummy lead(16) is installed in a non-redundant part.</p> |
