| 摘要 |
A semiconductor pickup device is provided to press the bended edge of the semiconductor chip to improve the warpage of the semiconductor chip and to reduce the pick-up fault of the semiconductor chip. The semiconductor chip pickup device(100) is comprised of wafer support member(10), semiconductor chip pusher unit(20), and pickup module(30). The wafer support member supports the mount frame(15). The mount frame is to fix the mount tape with which semiconductor chips(14) are adhered. The semiconductor chip pusher unit is the apparatus for pressing the edge of each semiconductor chip. The semiconductor chip pressurized by the semiconductor chip pusher unit is picked up from the pickup module. The semiconductor chip pusher body(22) presses the upper side of the semiconductor chip towards the wafer support member.
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