发明名称 OVERLAY ELECTROMAGNETIC BANDGAP STRUCTURE AND A MANUFACTURING METHOD THEREOF
摘要 <p>An overlay EBG(Electromagnetic Bandgap) structure is provided to reduce the leakage loss of the electro magnetic wave through substrate and to control conveniently the frequency characteristic. The EBG structure comprises the transmit line(101), and the plate(102) and the via(103). The transmit line is formed on the substrate(201) and delivers signals. The plate is separated from the transmit line. The via connects the transmit line and plate. The plate and via are periodically formed having the predetermined interval in the longitudinal direction of the transmit line. The first metal layer is deposited on the substrate to form the transmit line. Next, the oxide film is coated on the substrate and is etched to form the via hole. Finally, the second metal layer is deposited to form the plate connected to one end of via and the via.</p>
申请公布号 KR20090036954(A) 申请公布日期 2009.04.15
申请号 KR20070102266 申请日期 2007.10.10
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 HWANG, CHEOL GYU;CHOI, SUNG TAE;CHOI, JUNG HAN;KIM, YOUNG HWAN;LEE, DONG HYUN
分类号 H01L23/544 主分类号 H01L23/544
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