| 摘要 |
A method of fabricating for a printed circuit board is provided to prevent discharge of copper by removing a planted wire. A copper clad material(150) is made of an insulator. The copper foil is adhered to upper side and lower side of CCL. The copper foil is pattern and the plating-wire(109) is formed in CCL upper side and lower side. A solder resist(112) is coated to expose the copper wire on CLL upper side and lower side to the outside. The nickel(110) and gold(111) are plated on the plated-wire, and a tape is used for removing the nickel, the gold, and planted wire.
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