| 摘要 |
A method and an apparatus for testing destruction/non-destruction of a semiconductor package are provided to effectively grasp an error reason by etching a protective member of an error part of a semiconductor package. An apparatus for testing destruction/non-destruction of a semiconductor package includes a chamber(10), a thermal radiation irradiation unit(20), a first image generation unit(30), a decapsulation unit(40), and a second image generation unit(50). The chamber loads a semiconductor package(16). The semiconductor package has an interconnection and a protective member. The thermal radiation irradiation unit irradiates a thermal radiation to the protective member of the semiconductor package. The first image generation unit generates a non-destruction image. The decapsulation unit etches the protective member corresponding to an error part of the semiconductor package. The second image unit generates a destruction image.
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