发明名称 |
Method of producing a universal semiconductor housing with precrosslinked plastic embedding compounds |
摘要 |
An electronic component and a blank have plastic embedding compounds of a first and a second plastic layer. Semiconductor chips are embedded in the first plastic layer in such a way that their marginal sides are surrounded by a bead. The second plastic layer compensates for the unevenness of a upper boundary of the first plastic layer.
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申请公布号 |
US7517722(B2) |
申请公布日期 |
2009.04.14 |
申请号 |
US20060491746 |
申请日期 |
2006.07.24 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
GOLLER BERND;HAGEN ROBERT-CHRISTIAN;OFNER GERALD;STUEMPFL CHRISTIAN;WEIN STEFAN;WOERNER HOLGER |
分类号 |
H01L21/44;H01L21/48;H01L21/50;H01L21/56;H01L23/31 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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