发明名称 |
Multiple die stack apparatus employing T-shaped interposer elements |
摘要 |
Multiple integrated circuit devices in a stacked configuration that use a spacing element for allowing increased device density and increased thermal conduction or heat removal for semiconductor devices and the methods for the stacking thereof are disclosed.
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申请公布号 |
US7518227(B2) |
申请公布日期 |
2009.04.14 |
申请号 |
US20070840815 |
申请日期 |
2007.08.17 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
AKRAM SALMAN |
分类号 |
H01L23/02;H01L23/12;H01L23/40;H01L23/48;H01L23/52;H01L25/065 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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