发明名称 |
Semiconductor testing device |
摘要 |
A semiconductor device has a bonding pad configured to be bonded to a bonding member, a test pad configured to contact with a test probe at a test, and an internal circuit electrically connected to the bonding pad and the test pad. The bonding pad overlaps with the internal circuit in a direction vertical to a surface of a semiconductor chip. The test pad does not overlap with the internal circuit in the direction.
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申请公布号 |
US7518242(B2) |
申请公布日期 |
2009.04.14 |
申请号 |
US20040995467 |
申请日期 |
2004.11.24 |
申请人 |
NEC ELECTRONICS CORPORATION |
发明人 |
HIRAI MIHO |
分类号 |
H01L21/60;H01L23/48;G01R31/28;G11C29/48;H01L23/485;H01L23/58 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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