发明名称 Device cooling system
摘要 A device cooling system comprises a heat pipe disposed in a device, the heat pipe having a condenser portion and at least two divergent evaporator portions, the at least two evaporator portions coupled to at least one heat-generating component of the device.
申请公布号 US7518861(B2) 申请公布日期 2009.04.14
申请号 US20070788462 申请日期 2007.04.20
申请人 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 发明人 LEV JEFFREY A.;TRACY MARK S.
分类号 H05K7/20 主分类号 H05K7/20
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