发明名称 |
Contact structure of a semiconductor device |
摘要 |
In one embodiment, a semiconductor device comprises a conductive pad formed in a semiconductor substrate. The semiconductor device further includes a conductive pattern overlying a peripheral region of the conductive pad. The conductive pattern has an opening to expose another region of the conductive pad. The semiconductor device also includes a conductive contact extending through the opening. The conductive contact is electrically connected to the conductive pad. As a result, manufacturing cost for the semiconductor device may be reduced while manufacturing throughput may be improved.
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申请公布号 |
US7518245(B2) |
申请公布日期 |
2009.04.14 |
申请号 |
US20040875008 |
申请日期 |
2004.06.22 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
PARK JE-MIN |
分类号 |
H01L23/48;H01L27/108;H01L21/00;H01L21/28;H01L21/60;H01L21/768;H01L21/8242;H01L23/52;H01L27/105 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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