| 摘要 |
A method for making an interconnect is provided. The method includes depositing a conductive layer on a substrate, depositing a protective layer on the conductive layer, patterning the protective layer to form openings to the conductive layer, depositing contact pads on the conductive layer through the openings in the protective layer, the contact pads comprising a conductive material, and patterning the conductive layer and the protective layer to form electrical traces on the substrate.
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