发明名称 Laser processing apparatus and laser processing method
摘要 A laser processing apparatus comprises a laser source, a substrate-holding unit, a liquid-supplying unit, a support which has a plurality of mask patterns including a specific mask pattern for imparting a cross-sectional shape to the laser beam, and a support-driving mechanism which moves the support. The liquid-supplying unit supplies the liquid to the substrate, forming a liquid film thereon. The support-driving mechanism moves the support, aligning the specific mask pattern with an axis of the laser beam. The laser beam emitted from the laser unit passes through the specific mask pattern, acquiring a specific cross-sectional shape, and is applied to the substrate through the liquid film, illuminating.
申请公布号 US7518087(B2) 申请公布日期 2009.04.14
申请号 US20050252630 申请日期 2005.10.19
申请人 TOKYO ELECTRON LIMITED 发明人 KOGA NORIHISA;KOGA SHINJI;YOSHITAKA NAOTO;NISHIYA AKIRA
分类号 B23K26/06;B23K26/38;G06F19/00;H01L21/027;H01S3/00 主分类号 B23K26/06
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