发明名称 |
Apparatus and system for an IC substrate, socket, and assembly |
摘要 |
An apparatus and system including a substrate having a plurality of through-holes therethrough, and an integrated circuit (IC) socket frame to mount to the substrate. The IC socket frame may include a plurality of beam features, each extending from a socket frame body and corresponding in arrangement to the plurality of through-holes through the substrate.
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申请公布号 |
US7518222(B2) |
申请公布日期 |
2009.04.14 |
申请号 |
US20060394855 |
申请日期 |
2006.03.30 |
申请人 |
INTEL CORPORATION |
发明人 |
MA XIAOQING;GONZALEZ KING;ONGCHIN STEWART;TISDALE STEPHEN;SHERMAN VADIM |
分类号 |
H01L23/02 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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