发明名称 |
Stacked electronics for sensors |
摘要 |
A stacked electronics module comprises a first layer including a first substrate having a front side and a backside, a first electrical interconnect layer disposed on the first substrate and a first electronic device disposed on the front side of the first substrate. In addition, the stacked electronics module comprises a second layer including a second substrate having a front side and a backside, a second electrical interconnect layer disposed on the second substrate and a second electronic device disposed on the front side of the second substrate. |
申请公布号 |
US7518251(B2) |
申请公布日期 |
2009.04.14 |
申请号 |
US20040003602 |
申请日期 |
2004.12.03 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
FISHER RAYETTE ANN;BURDICK, JR. WILLIAM EDWARD;ROSE JAMES WILSON |
分类号 |
H01L23/52;H01L23/48;H01L29/40 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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