| 摘要 |
According to the present invention, for collective molding of semiconductor devices, a semiconductor substrate includes first electrodes formed on the front side, second electrodes formed on the back side and connected to external electrode terminals, and a plurality of semiconductor element mounting regions 203. Along partition lines 202 for partitioning the semiconductor substrate into the plurality of semiconductor element mounting regions 203, recessed portions 205 are formed on the partition lines 202 on the front side of the semiconductor substrate.
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