| 摘要 |
Provided is a multichip module having a module substrate 2 on which an electronic component 3 is mounted, a conductor 8 electrically connected to a land 12 formed on the module substrate 2, a molding resin 6 covering the electronic component 3 and the conductor 8, and a conductive film 7 formed continuously on the molding resin 6 and the conductor 8 exposed from the molding resin 6.
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