| 摘要 |
In order to realize a semiconductor device which is easily mounted on a circuit board and which has high mounting reliability, a semiconductor device 1 of the present invention includes: a semiconductor substrate 2; and an Au bump 3 provided on an electrode 21. The Au bump 3 is provided with a projection 3a. Also, on a surface of the Au bump 3, a solder layer 32 is formed via a Ni layer 31. The projection 3a makes it possible to easily mount the semiconductor device 1 by applying a small weight. Further, even if the amount of solder 62 supplied on an electrode 61 on a circuit board 6 is reduced, it is possible to bond the semiconductor device with a sufficient amount of solder during mounting. Furthermore, because a Ni layer 31 prevents dissolution of the bump, it is possible to ensure high mounting reliability. |
