Component e.g. electronic component such as sensor, has three-dimensional soldering surface with soldering body having slots at surface, where slots are fixed for receiving of fluid solder during soldering process by capillary forces

摘要

The component (10) has a three-dimensional soldering surface with a soldering body (11) having slots (12) at a surface to be soldered, where the slots are fixed for receiving of a fluid solder during soldering process by capillary forces. The slots have open side surface in an edge area of the soldering body and a minimum depth of 10 micrometers. The slots have a maximum opening width of 20 micrometers and continuous structures that are arranged next to each other. The soldering body has one of metals such as copper, nickel, silver and gold. An independent claim is also included for a method for manufacturing a component.