CHEMICAL MECHANICAL POLISHING COMPOSITION FOR SILICON NITRIDE LAYER

摘要

A slurry composition is provided to polish a silicon nitride film and to be used as slurry which selectively polishes the silicon nitride film by being applied to the chemical mechanical polishing of a substrate including the silicon oxide film and silicon nitride film. A slurry composition for chemical mechanical polishing of a silicon nitride film contains an abrasive selected from zeolite or aluminosilicate and has pH of 1-7. The content of the abrasive based on the total weight of the slurry composition is 0.01-10 weight%. The slurry composition further contains at least one selected from a boric acid, carboxylic acid or amino acid.