发明名称 BASE MATERIAL WITH BONDING FILM, BONDING METHOD, AND BONDED BODY
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a base material with a bonding film equipped with a bonding film capable of efficiently bonding to a body to be bonded firmly with high accuracy at low temperatures, a bonding method capable of efficiently bonding the base material with the bonding film to the body to be bonded at low temperatures, and a highly reliable bonded body composed by strongly bonding the base material with the bonding film to the body to be bonded. <P>SOLUTION: This base material with the bonding film includes a substrate 2, the bonding film 3, and an intermediate layer 7 interposed between the substrate 2 and the bonding film 3, and can be bonded to an opposing substrate (other body to be bonded) 4. In the bonding film 3 provided to the base material with the bonding film, by applying energy to at least one portion of its region, a leaving group existing near a surface 35 is separated, and bonding performance with the opposing substrate 4 on the surface 35 of the bonding film 3 is developed. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009073128(A) 申请公布日期 2009.04.09
申请号 JP20070246302 申请日期 2007.09.21
申请人 SEIKO EPSON CORP 发明人 GOMI KAZUHIRO
分类号 B32B9/00;C23C14/34;C23C14/46;H01L21/02 主分类号 B32B9/00
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