发明名称 MODUL MIT MINDESTENS ZWEI PAAREN VON MODULVERBINDUNGSPLATTEN
摘要 In the case of a module ( 1 ) for a data carrier ( 11 ) designed for contactless communication, the module ( 1 ) has a chip ( 3 ) with at least two pairs ( 20, 21 ) of chip connection contacts ( 4, 5, 6, 7 ) and with at least two pairs ( 22, 23 ) of module connecting plates ( 24, 25, 26, 27 ), wherein in a starting position, the shapes of the plate surfaces of the module connecting plates ( 24, 25, 26, 27 ) result in a particular plate pattern, and differ with regard to the shape of the plate surfaces such that when all the module connecting plates ( 24, 25, 26, 27 ) are rotated around a mid-point ( 8 ) of the module ( 1 ), the same plate pattern results respectively after 180°.
申请公布号 DE602004019656(D1) 申请公布日期 2009.04.09
申请号 DE20046019656T 申请日期 2004.08.02
申请人 NXP B.V. 发明人 HUBMER, PAUL;SCHOBER, JOACHIM
分类号 G06K19/077 主分类号 G06K19/077
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