| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device equipped with an insulating film capable of suppressing the occurrence of failures such as the impairments of heat resistance and insulation and with metal wiring. SOLUTION: The manufacturing method includes: forming on a substrate, an insulating film 102 having hygroscopicity; forming dummy contact holes and contact holes in the insulating film; subjecting the substrate to a heating treatment to eliminate water content contained in the insulating film; and respectively forming contacts 103 and dummy contacts 110 constituted of a metal film. By the heating treatment, water content in the insulating film can be eliminated through the contact hole and the dummy contact hole. COPYRIGHT: (C)2009,JPO&INPIT |
