发明名称 |
CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
There is provided a circuit board to which a solder ball composed of a lead (Pb)-free solder is to be connected, a semiconductor device including an electrode and a solder ball composed of a lead (Pb)-free solder disposed on the electrode, and a method of manufacturing the semiconductor device, in which mounting reliability can be improved by enhancing the bonding strength (adhesion strength) between the solder ball composed of a lead (Pb)-free solder and the electrode.
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申请公布号 |
US2009090543(A1) |
申请公布日期 |
2009.04.09 |
申请号 |
US20080243500 |
申请日期 |
2008.10.01 |
申请人 |
FUJITSU LIMITED |
发明人 |
FURUYAMA MASAHARU;MIZUTANI DAISUKE;SAKUYAMA SEIKI;AKAMATSU TOSHIYA |
分类号 |
H05K1/09;H05K1/16;H05K3/10 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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