发明名称 PROXIMITY COMMUNICATION PACKAGE FOR PROCESSOR, CACHE AND MEMORY
摘要 A "sombrero" bridge transports signals between a processor (104) and one or more cache memories (106, 108). The bridge (114) surrounds the processor's perimeter, and includes an aperture opposite the processor through which power and data can be provided to the processor from another device. The bridge exchanges signals with the cache memories via capacitively coupled proximity connections (110, 112). The bridge communicates with the processor via conductive connections and optionally proximity connections. Spacing between opposing pads of the proximity connection (s) between the bridge and the cache memories can be provided by recesses in a surface of the cache memory, corresponding recesses (552, 553) in an opposing surface (514) of the bridge, and a ball (550, 551) for each matching pair of corresponding cache memory and bridge recesses. The ball fits in and between the recesses of the matching pair. The recess depths and ball diameter (s) constrain a minimum distance between opposing pads of the proximity connection (s).
申请公布号 WO2009045716(A1) 申请公布日期 2009.04.09
申请号 WO2008US76603 申请日期 2008.09.17
申请人 SUN MICROSYSTEMS, INC.;CUNNINGHAM, JOHN E.;KRISHNAMOORTHY, ASHOK V.;LANDIN, ANDERS 发明人 CUNNINGHAM, JOHN E.;KRISHNAMOORTHY, ASHOK V.;LANDIN, ANDERS
分类号 H01L25/18;H01L23/48 主分类号 H01L25/18
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