MICROELECTRONIC INTERCIONNECT SUBSTRATE AND PACKAGING TECHNIQUES

摘要

A LED (Light Emitting Diode) substrate and packaging for a single diode or a diode array is disclosed. Described herein is a substrate (200) with direct metal connection of low thermal path between a die and a bottom surface of the substrate. The substrate comprises an aluminum conductive area (202) enclosed by anodized aluminum oxide isolation structures (204). The resulting substrate and packaging afford the required electrical interconnections and enhanced thermal performance while maintaining excellent mechanical properties. The same substrate and packaging concepts can be applied for other high power devices requiring high thermal conductivity substrate and package.