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发明名称
Flip-Chip Verbindung mit verbesserter Strombelastbarkeit
摘要
申请公布号
DE602004019598(D1)
申请公布日期
2009.04.09
申请号
DE200460019598T
申请日期
2004.06.04
申请人
DELPHI TECHNOLOGIES INC.
发明人
MITHAL, PANKAJ;HIGDON, WILLIAM D.;GOSE, MARK W.;DIKEMAN, JOHN M.
分类号
H01L23/485;H01L21/60;H01L23/528
主分类号
H01L23/485
代理机构
代理人
主权项
地址
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