| 摘要 |
A substrate treatment apparatus is provided to prevent the damage of a wafer by using ultrapure spread device without a nozzle of the wafer. A substrate processing apparatus washes a plurality of wafers, and a process bath includes a substrate process bath, a drainage pipe, a cleaning solution, and the ultrapure water spray device. An ultrapure water device includes an ultrapure water supply unit(106), a compression air supply unit(108), a supply path(114). The compression air supply unit supplies a nitrogen gas, and the supply path connects the ultrapure water supply unit with the compression supply unit, a two-fluid nozzle.
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