| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a non-contact type IC card which can improve quality by reducing unevenness in thickness or unevenness in printing. <P>SOLUTION: The non-contact type IC card is composed to have a laminated body sheet 8 on which a plurality of sets of wound antennas 4 and IC chips 5 are arranged while held between two formation plates 6a and 6b in a state where a spacer member 7 is inserted in a periphery part 6c, and is hot-press molded. <P>COPYRIGHT: (C)2009,JPO&INPIT |
