发明名称 BASE FOR ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a piezoelectric vibration device achieving highly reliable air-tight sealing by using a base reducing temperature gradient within it when air-tightly sealed and coping with low-profile. SOLUTION: A base 1 of rectangular form in a plan view includes an annular bank part 2 surrounding a recessed part 3 and having a metal sealing member peripherally formed on its upper surface. The base 1 is a laminate of a plurality of layers of insulating materials and heat radiating conductors 41, 42 are formed between laminated layers of the laminate. A heat radiating conductor 43 is laid on a recessed bottom face 12. In a position of any one of an outer side face, an inner part and an inner side face of at least one side of the bank part 2 or a combination of two or more of the outer side face, the inner part and the inner side face, there is formed a heat conduction part 5 extending from an upper surface 11 of the bank part in a depth direction of the bank part 2 and connected with the heat radiating conductors 41, 42. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009076589(A) 申请公布日期 2009.04.09
申请号 JP20070242659 申请日期 2007.09.19
申请人 DAISHINKU CORP 发明人 YO REIEN;ARIMURA HIROYUKI
分类号 H01L23/34;H03H9/02 主分类号 H01L23/34
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