| 摘要 |
PROBLEM TO BE SOLVED: To provide an image pickup device capable of suppressing temperature rise in a solid state image sensor, while reducing external force load imposed on the solid state image sensor using a comparatively simple structure. SOLUTION: The image pickup device comprises a color separation prism composed of a plurality of prism members for separating light into a plurality of color components, a plurality of solid state image sensors individually fixed to the plurality of prism members, a plurality of image sensor substrates on which the plurality of solid state image sensors are mounted individually, an image control substrate into which an image pick-up signal generated by each of the plurality of image sensor substrates is inputted, and a flexible substrate connected to the image control substrate. The flexible substrate comprises a signal transmission layer connected to each of the plurality of image sensor substrates and including a transmission path for transmitting an image pick-up signal to the image control substrate and a thermal conduction layer made of highly thermally-conductive material and connected to each of the plurality of solid state image sensors and also fixed to the signal transmission layer through an insulating layer for delivering heat generated in the solid state image sensor. COPYRIGHT: (C)2009,JPO&INPIT |
