| 摘要 |
PROBLEM TO BE SOLVED: To provide a multi-layer coreless wiring substrate and a manufacturing method thereof releasing stress applied to the wiring substrate to prevent a warpage and deformation of the wiring substrate while increasing the stiffness of the wiring substrate itself. SOLUTION: In the multi-layer coreless wiring substrates 100, 100a-100d having a plurality of insulating layers 20, the plurality of insulating layers include reinforced insulating layers 10 made of resin containing reinforcement members 11, 11a-11c and the reinforcement member has a planar form with apertures and/or slits. COPYRIGHT: (C)2009,JPO&INPIT |
