| 摘要 |
PROBLEM TO BE SOLVED: To increase a repair execution rate of, in particular, open defects occurring in a first wiring layer and short defects occurring in a second wiring layer among various defects occurring in a circuit pattern. SOLUTION: As a structure of this circuit board provided with the first wiring layer where the circuit pattern including a gate electrode 109 becoming an island-like pattern and a capacitor electrode 112 is formed, a first insulation film covering the first wiring layer, the second wiring layer formed on the first insulation film, and a second insulation film covering the second wiring layer, redundant pattern parts 1001 and 1002 are formed on the gate electrode 109 and the capacitor electrode 112, respectively. COPYRIGHT: (C)2009,JPO&INPIT
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