发明名称 CHIP TYPE LC COMPOUND ELEMENT
摘要 PROBLEM TO BE SOLVED: To provide a chip type LC compound element capable of suppressing variations in the inductance value of a coil part and in the capacitance value of a capacitor part due to contraction of a conductor pattern and as a result having a controllable variations in the characteristics and a high reliability. SOLUTION: For the chip type LC compound element, a protection part 5 is formed by layering insulating resin layers in which the conductor patterns 1a-1c are embedded in an insulator layer 8, and a coil part 2, a capacitor part 3 and an outside electrode part 6 are formed by layering the conductor patterns 1a-1c embedded in the insulator layer 8, and further the insulator layer 8 is formed by photosensitizing a photosensitive resin and the coductor patterns 1a-1c are formed with copper deposited by plating, and the conductor patterns 1a-1c and the insulator layer 8 are formed by a non-baking treatment. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009076719(A) 申请公布日期 2009.04.09
申请号 JP20070244830 申请日期 2007.09.21
申请人 PANASONIC CORP 发明人 TOMITA HIROSHI;TAOKA MIKIO
分类号 H01F27/00;H01F17/00;H01F27/29;H01G4/30;H01G4/40 主分类号 H01F27/00
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